Items where Author is "Georgel, V."

Contribution in Book/Report/Proceedings

Liu, Hongyuan and Strusevich, N. and Stoyanov, S. and Bailey, C. and Richardson, Andrew M. D. and Dumas, N. and Yannou, J. M. and Georgel, V. (2006) Modelling the behaviour of soldier joints for wafer level SIP. In: Proceedings of the 8th IEEE electronics packaging technology conference. :. UNSPECIFIED.