Liu, Hongyuan and Strusevich, N. and Stoyanov, S. and Bailey, C. and Richardson, Andrew M. D. and Dumas, N. and Yannou, J. M. and Georgel, V. (2006) Modelling the behaviour of soldier joints for wafer level SIP. In: Proceedings of the 8th IEEE electronics packaging technology conference. UNSPECIFIED.
Full text not available from this repository.Item Type:
Contribution in Book/Report/Proceedings
Uncontrolled Keywords:
/dk/atira/pure/researchoutput/libraryofcongress/ta
Subjects:
?? TA ENGINEERING (GENERAL). CIVIL ENGINEERING (GENERAL) ??
Departments:
ID Code:
8149
Deposited By:
Deposited On:
11 Apr 2008 12:15
Refereed?:
No
Published?:
Published
Last Modified:
21 Nov 2022 13:49