Modelling the behaviour of soldier joints for wafer level SIP.

Liu, Hongyuan and Strusevich, N. and Stoyanov, S. and Bailey, C. and Richardson, Andrew M. D. and Dumas, N. and Yannou, J. M. and Georgel, V. (2006) Modelling the behaviour of soldier joints for wafer level SIP. In: Proceedings of the 8th IEEE electronics packaging technology conference. UNSPECIFIED.

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Contribution in Book/Report/Proceedings
Uncontrolled Keywords:
/dk/atira/pure/researchoutput/libraryofcongress/ta
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ID Code:
8149
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Deposited On:
11 Apr 2008 12:15
Refereed?:
No
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Published
Last Modified:
14 Jan 2020 00:38