Magnetoresistance in electrodeposited Ni-Fe-Cu/Cu multilayers

ATTENBOROUGH, K and HART, R and Lane, Stephen and ALPER, M and SCHWARZACHER, W (1995) Magnetoresistance in electrodeposited Ni-Fe-Cu/Cu multilayers. Journal of Magnetism and Magnetic Materials, 148 (1-2). pp. 335-336. ISSN 0304-8853

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Abstract

Multilayers of Ni-Fe-Cu/Cu have been electrodeposited from a single electrolyte onto polycrystalline (100) textured and (100) single crystal copper substrates. Bilayer thicknesses as low as 30 Angstrom have been achieved, as confirmed by X-ray diffraction. Room temperature magnetoresistance measurements show the presence of giant magnetoresistance (GMR) and an anisotropic magnetoresistance (AMR) component in the films.

Item Type:
Journal Article
Journal or Publication Title:
Journal of Magnetism and Magnetic Materials
Uncontrolled Keywords:
/dk/atira/pure/subjectarea/asjc/3100/3104
Subjects:
ID Code:
52200
Deposited By:
Deposited On:
22 Dec 2011 16:10
Refereed?:
Yes
Published?:
Published
Last Modified:
01 Jan 2020 07:46