Magnetoresistance in electrodeposited Ni-Fe-Cu/Cu multilayers

ATTENBOROUGH, K and HART, R and Lane, Stephen and ALPER, M and SCHWARZACHER, W (1995) Magnetoresistance in electrodeposited Ni-Fe-Cu/Cu multilayers. Journal of Magnetism and Magnetic Materials, 148 (1-2). pp. 335-336. ISSN 0304-8853

Abstract

Multilayers of Ni-Fe-Cu/Cu have been electrodeposited from a single electrolyte onto polycrystalline (100) textured and (100) single crystal copper substrates. Bilayer thicknesses as low as 30 Angstrom have been achieved, as confirmed by X-ray diffraction. Room temperature magnetoresistance measurements show the presence of giant magnetoresistance (GMR) and an anisotropic magnetoresistance (AMR) component in the films.