Magnetoresistance in electrodeposited Ni-Fe-Cu/Cu multilayers

ATTENBOROUGH, K and HART, R and Lane, Stephen and ALPER, M and SCHWARZACHER, W (1995) Magnetoresistance in electrodeposited Ni-Fe-Cu/Cu multilayers. Journal of Magnetism and Magnetic Materials, 148 (1-2). pp. 335-336. ISSN 0304-8853

Full text not available from this repository.


Multilayers of Ni-Fe-Cu/Cu have been electrodeposited from a single electrolyte onto polycrystalline (100) textured and (100) single crystal copper substrates. Bilayer thicknesses as low as 30 Angstrom have been achieved, as confirmed by X-ray diffraction. Room temperature magnetoresistance measurements show the presence of giant magnetoresistance (GMR) and an anisotropic magnetoresistance (AMR) component in the films.

Item Type: Journal Article
Journal or Publication Title: Journal of Magnetism and Magnetic Materials
Uncontrolled Keywords: /dk/atira/pure/subjectarea/asjc/3100/3104
Departments: Faculty of Science and Technology > Lancaster Environment Centre
ID Code: 52200
Deposited By: ep_importer_pure
Deposited On: 22 Dec 2011 16:10
Refereed?: Yes
Published?: Published
Last Modified: 30 Sep 2019 16:27

Actions (login required)

View Item View Item