Items where Author is "Liu, Changqing"

Journal Article

Tian, Yingtao and Liu, Changqing and Hutt, David and Stevens, Bob (2014) Electrodeposition of indium bumps for ultrafine pitch interconnection. Journal of Electronic Materials, 43 (2). pp. 594-603. ISSN 0361-5235

Kaufmann, Jens Georg and Desmulliez, Marc P. Y. and Tian, Yingtao and Price, Dennis and Hughes, Mike and Strusevich, Nadia and Bailey, Chris and Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076

Contribution in Book/Report/Proceedings

Tian, Yingtao and Liu, Changqing and Hutt, David and Stevens, Bob and Flynn, David and Desmulliez, Marc P. Y. (2011) Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation. In: Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on :. IEEE, pp. 739-744. ISBN 9781457717703

Tian, Yingtao and Hutt, David A. and Liu, Changqing and Stevens, Bob (2009) High density indium bumping through pulse plating used for pixel X-ray detectors. In: Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on :. IEEE, pp. 456-460. ISBN 9781424446582

Tian, Yingtao and Liu, Changqing and Hutt, David and Stevens, Bob and Flynn, David and Desmulliez, Marc P. Y. (2009) High density indium bumping using electrodeposition enhanced by megasonic agitation. In: Electronics Packaging Technology Conference, 2009. EPTC '09. 11th :. IEEE, pp. 31-35. ISBN 9781424450992

Tian, Yingtao and Kaufmann, Jens and Liu, Changqing and Hutt, David A. and Stevens, Bob and Desmulliez, Marc P. Y. (2008) Megasonic enhanced wafer bumping process to enable high density electronics interconnection. In: Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd :. IEEE, pp. 725-729. ISBN 9781424428137