Items where Author is "Kaufmann, Jens"

Tian, Yingtao and Kaufmann, Jens and Liu, Changqing and Hutt, David A. and Stevens, Bob and Desmulliez, Marc P. Y. (2008) Megasonic enhanced wafer bumping process to enable high density electronics interconnection. In: Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd :. IEEE, pp. 725-729. ISBN 9781424428137