Items where Author is "Hutt, David A."

Tian, Yingtao and Hutt, David A. and Liu, Changqing and Stevens, Bob (2009) High density indium bumping through pulse plating used for pixel X-ray detectors. In: Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on :. IEEE, pp. 456-460. ISBN 9781424446582

Tian, Yingtao and Kaufmann, Jens and Liu, Changqing and Hutt, David A. and Stevens, Bob and Desmulliez, Marc P. Y. (2008) Megasonic enhanced wafer bumping process to enable high density electronics interconnection. In: Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd :. IEEE, pp. 725-729. ISBN 9781424428137