Items where Author is "Hutt, David"

Journal Article

Tian, Yingtao and Liu, Changqing and Hutt, David and Stevens, Bob (2014) Electrodeposition of indium bumps for ultrafine pitch interconnection. Journal of Electronic Materials, 43 (2). pp. 594-603. ISSN 0361-5235

Kaufmann, Jens Georg and Desmulliez, Marc P. Y. and Tian, Yingtao and Price, Dennis and Hughes, Mike and Strusevich, Nadia and Bailey, Chris and Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076

Contribution in Book/Report/Proceedings

Tian, Yingtao and Liu, Changqing and Hutt, David and Stevens, Bob and Flynn, David and Desmulliez, Marc P. Y. (2011) Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation. In: Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on :. IEEE, pp. 739-744. ISBN 9781457717703

Tian, Yingtao and Liu, Changqing and Hutt, David and Stevens, Bob and Flynn, David and Desmulliez, Marc P. Y. (2009) High density indium bumping using electrodeposition enhanced by megasonic agitation. In: Electronics Packaging Technology Conference, 2009. EPTC '09. 11th :. IEEE, pp. 31-35. ISBN 9781424450992