Items where Author is "Desmulliez, Marc P. Y."

Tian, Yingtao and Liu, Changqing and Hutt, David and Stevens, Bob and Flynn, David and Desmulliez, Marc P. Y. (2011) Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation. In: Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on :. IEEE, pp. 739-744. ISBN 9781457717703

Kaufmann, Jens Georg and Desmulliez, Marc P. Y. and Tian, Yingtao and Price, Dennis and Hughes, Mike and Strusevich, Nadia and Bailey, Chris and Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076

Tian, Yingtao and Liu, Changqing and Hutt, David and Stevens, Bob and Flynn, David and Desmulliez, Marc P. Y. (2009) High density indium bumping using electrodeposition enhanced by megasonic agitation. In: Electronics Packaging Technology Conference, 2009. EPTC '09. 11th :. IEEE, pp. 31-35. ISBN 9781424450992

Moffat, Brian G. and Abraham, Eitan and Desmulliez, Marc P. Y. and Koltsov, Dennis and Richardson, Andrew (2008) Failure mechanisms of legacy aircraft wiring and interconnects. IEEE Transactions on Dielectrics and Electrical Insulation, 15 (3). pp. 808-822. ISSN 1070-9878

Tian, Yingtao and Kaufmann, Jens and Liu, Changqing and Hutt, David A. and Stevens, Bob and Desmulliez, Marc P. Y. (2008) Megasonic enhanced wafer bumping process to enable high density electronics interconnection. In: Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd :. IEEE, pp. 725-729. ISBN 9781424428137