Font, Francesc and Hocking, Graeme and Burton, David Antony and Cregan, Vincent and Iliev, Pavel (2016) Stress effects of silica particles in a semiconductor package molding compound. In: ESGI 110 Study Group Report :. University of Limerick, Limerick, pp. 1-23.
Abstract
The stresses induced on a silicon chip encased in an epoxy compound are considered due to absorption of moisture and the presence of silica particles in the coating. A range of different approaches are considered including a one-dimensional model for the curvature due to the absorption of water in a bi-lateral sheet, numerical simulations for the stress at the molding compound-silicon die interface and a two-dimensional model in the complex plane.