Stress effects of silica particles in a semiconductor package molding compound

Font, Francesc and Hocking, Graeme and Burton, David Antony and Cregan, Vincent and Iliev, Pavel (2016) Stress effects of silica particles in a semiconductor package molding compound. In: ESGI 110 Study Group Report. University of Limerick, Limerick, pp. 1-23.

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Abstract

The stresses induced on a silicon chip encased in an epoxy compound are considered due to absorption of moisture and the presence of silica particles in the coating. A range of different approaches are considered including a one-dimensional model for the curvature due to the absorption of water in a bi-lateral sheet, numerical simulations for the stress at the molding compound-silicon die interface and a two-dimensional model in the complex plane.

Item Type: Contribution in Book/Report/Proceedings
Additional Information: For the context of the report see Study Groups on http://www.macsi.ul.ie/
Departments: Faculty of Science and Technology > Physics
ID Code: 78954
Deposited By: ep_importer_pure
Deposited On: 04 Apr 2016 08:18
Refereed?: Yes
Published?: Published
Last Modified: 21 Nov 2019 00:48
URI: https://eprints.lancs.ac.uk/id/eprint/78954

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