Stress effects of silica particles in a semiconductor package molding compound

Font, Francesc and Hocking, Graeme and Burton, David Antony and Cregan, Vincent and Iliev, Pavel (2016) Stress effects of silica particles in a semiconductor package molding compound. In: ESGI 110 Study Group Report. University of Limerick, Limerick, pp. 1-23.

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Abstract

The stresses induced on a silicon chip encased in an epoxy compound are considered due to absorption of moisture and the presence of silica particles in the coating. A range of different approaches are considered including a one-dimensional model for the curvature due to the absorption of water in a bi-lateral sheet, numerical simulations for the stress at the molding compound-silicon die interface and a two-dimensional model in the complex plane.

Item Type:
Contribution in Book/Report/Proceedings
Additional Information:
For the context of the report see Study Groups on http://www.macsi.ul.ie/
ID Code:
78954
Deposited By:
Deposited On:
04 Apr 2016 08:18
Refereed?:
Yes
Published?:
Published
Last Modified:
26 May 2020 00:44