A review on carbon based materials as on-chip interconnects

Sadeghi, Hatef and Redoute, Jean-Michel and Lai, Daniel T. H. and Ahmadi, M. T. and Ismail, Razali (2011) A review on carbon based materials as on-chip interconnects. Proceedings of SPIE, 8204. ISSN 0277-786X

Full text not available from this repository.

Abstract

Interconnect wires are major technology components of modern high-speed integrated circuits. To overcome the latter's degradation caused by increasing miniaturization, there is an urgent need to look for alternative technologies. Since carbon based materials generate promising results, this paper focuses on describing the electrical properties of carbon based materials, in particular the use of graphene nanoribbon (GNR) as well as trilayer graphene nanoribbon (TGN) as next generation interconnects: since the conductance of TGN is less affected by external fields compared to GNR, it forms an improved choice for on-chip interconnects. The conductance model of TGN is derived and discussed in detail.

Item Type:
Journal Article
Journal or Publication Title:
Proceedings of SPIE
Subjects:
ID Code:
72820
Deposited By:
Deposited On:
02 Feb 2015 12:29
Refereed?:
Yes
Published?:
Published
Last Modified:
01 Jan 2020 09:07