Cheneler, D. and Teng, J. and Adams, M. and Anthony, C. J. and Carter, E. L. and Ward, M. (2011) Printed circuit board as a MEMS platform for focused ion beam technology. Microelectronic Engineering, 88 (1). pp. 121-126. ISSN 0167-9317
Full text not available from this repository.Abstract
By combining low-cost printed circuit board technology and focused ion beam techniques, a simple method has been developed to produce thermal microsensors in a robust package with straightforward electrical connectivity. Two devices have been developed to demonstrate the principle. The first was fabricated using a single step process comprised of FIB deposited platinum. The second device utilised a multistep process using FIB milled thermally evaporated Au on a PCB platform with through-plated vias. The performance of these devices was tested by measuring their thermo-electrical characteristics.