Electronic cooling of a submicron-sized metallic beam

Muhonen, J. T. and Niskanen, A. O. and Meschke, M. and Pashkin, Yuri and Tsai, J. S. and Sainiemi, L. and Franssila, S. and Pekola, J. P. (2009) Electronic cooling of a submicron-sized metallic beam. Applied Physics Letters, 94 (7). -. ISSN 0003-6951

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Abstract

We demonstrate electronic cooling of a suspended AuPd island using superconductor-insulator-normal metal tunnel junctions. This was achieved by developing a simple fabrication method for reliably releasing narrow submicron-sized metal beams. The process is based on reactive ion etching and uses a conducting substrate to avoid charge-up damage and is compatible with, e.g., conventional e-beam lithography, shadow-angle metal deposition, and oxide tunnel junctions. The devices function well and exhibit clear cooling, up to a factor of 2 at sub-Kelvin temperatures.

Item Type:
Journal Article
Journal or Publication Title:
Applied Physics Letters
Uncontrolled Keywords:
/dk/atira/pure/researchoutput/libraryofcongress/qc
Subjects:
ID Code:
57822
Deposited By:
Deposited On:
28 Aug 2012 14:53
Refereed?:
Yes
Published?:
Published
Last Modified:
05 Feb 2020 13:45