Nanoscale elastic imaging: a new metrology tool for low-k dielectric integration

Shekhawat, G. S. and Kolosov, Oleg and Briggs, G. Andrew D. and Shaffer, E. O. and Martin, S. J. and Geer, R. E. (2000) Nanoscale elastic imaging: a new metrology tool for low-k dielectric integration. In: Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International. IEEE, SAN FRANCISCO, pp. 96-98. ISBN 0-7803-6327-2

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Abstract

A new characterization tool based on ultrasonic force microscopy (UFM) has been developed to image the nanoscale mechanical properties of metal/low-k polymer damascence test structures. Metal and polymer regions are differentiated on the basis of elastic modulus with a spatial resolution less than or equal to 10 nm. This technique reveals a RIE-induced hardening of the low-k polymer at the metal/polymer interface and offers new opportunities for metrological reliability evaluation of low-k integration processes.

Item Type:
Contribution in Book/Report/Proceedings
Uncontrolled Keywords:
/dk/atira/pure/researchoutput/libraryofcongress/qc
Subjects:
ID Code:
57448
Deposited By:
Deposited On:
09 Oct 2012 13:25
Refereed?:
Yes
Published?:
Published
Last Modified:
22 Jul 2020 08:06