Towards a health monitor for system in package with MEMS functionality.

Dumas, Norbert and Richardson, Andrew (2006) Towards a health monitor for system in package with MEMS functionality. In: 12th IEEE international mixed signal workshop, 2006-01-212006-01-23.

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Abstract

This paper introduces a preliminary study about using a health monitor (HM) to contribute towards production and on-line testing of System in Package (SiP) that contain MEMS functions. The HM serves as a central unit for the test of both the structure and critical functions within the SiP. The study includes the review of existing test solution which could be in-tegrated in the HM and some initial ideas to test the MEMS functions as typically, BIST is not normally supported by these devices. A SiP RF transceiver is used as a case study. An evaluation of the feasibility of implementing a HM for testing a MEMS switch is presented. Preliminary simulation results obtained by superimposing a low frequency signal into the bias of the switch are encouraging.

Item Type:
Contribution to Conference (Paper)
Journal or Publication Title:
12th IEEE international mixed signal workshop
Uncontrolled Keywords:
/dk/atira/pure/researchoutput/libraryofcongress/tk
Subjects:
ID Code:
499
Deposited By:
Deposited On:
07 May 2007
Refereed?:
Yes
Published?:
Published
Last Modified:
28 Jul 2020 07:15