Closed-form equations for through-silicon via (TSV) parasitics in 3-D integrated circuits (ICs).

Weerasekera, Roshan and Pamunuwa, Dinesh B. and Grange, M. and Tenhunen, Hannu and Zheng, Li-Rong (2009) Closed-form equations for through-silicon via (TSV) parasitics in 3-D integrated circuits (ICs). In: Workshop Notes, Design, Automation and Test in Europe (DATE). UNSPECIFIED, Nice.

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ID Code:
31106
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Deposited On:
18 Dec 2009 15:39
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30 Oct 2020 08:31