Andreazza, A. and Dong, R. and Fox, H. and Gao, Y. and Gheewalla, P. and Huebner, M. and Li, Y. and Meng, L. and Muenstermann, D. and Peric, I. and Sabatini, F. and Ustuner, F. and Velthuis, J. and Zanzottera, R. (2025) ATLASPix3 serial powering and multi-chip module studies for future HV-CMOS tracker. Journal of Instrumentation, 20 (8): C08010. ISSN 1748-0221
Full text not available from this repository.Abstract
High voltage CMOS pixel sensors are proposed in many future particle physics experiments such as the HL-LHC upgrades and future circular colliders. The ATLASPix3 chip consists of 49104 pixels of dimension 50 μm × 150 μm, realised in 180 nm HVCMOS technology. It is the first full reticle size monolithic HVCMOS sensor suitable for construction of multi-chip modules and supporting serial powering through Shunt-Low-Dropout regulators. The readout architecture supports both triggered and triggerless readout with zero-suppression. With the ability to be operated in a multi-chip setting, a 4-layer telescope made with ATLASPix3 was developed, using a readout system made at KIT. To demonstrate the multi-chip capability and for its characterisation, a beam test was conducted at DESY using 3–6 GeV positron beams with the chips operated in triggerless readout mode with zero-suppression. Detailed electrical characterisations of the regulators are presented as well as multi-chip (quad module) readout and serial powering prototyping.