Finite element analysis to support component level fault modelling for MEMS.

Reichenbach, R. and Rosing, R. and Richardson, Andrew M. D. and Dorey, A. P. (2001) Finite element analysis to support component level fault modelling for MEMS. In: Proceedings of SPIE design, test, integration and packaging of MEMS symposium. UNSPECIFIED, pp. 147-158.

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Contribution in Book/Report/Proceedings
Uncontrolled Keywords:
/dk/atira/pure/researchoutput/libraryofcongress/ta
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ID Code:
20268
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Deposited On:
22 Dec 2008 14:14
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No
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Published
Last Modified:
01 Jan 2020 05:18