Finite element analysis to support component level fault modelling for MEMS.

Reichenbach, R. and Rosing, R. and Richardson, Andrew M. D. and Dorey, A. P. (2001) Finite element analysis to support component level fault modelling for MEMS. In: Proceedings of SPIE design, test, integration and packaging of MEMS symposium. UNSPECIFIED, pp. 147-158.

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Item Type: Contribution in Book/Report/Proceedings
Uncontrolled Keywords: /dk/atira/pure/researchoutput/libraryofcongress/ta
Subjects:
Departments: Faculty of Science and Technology > Engineering
ID Code: 20268
Deposited By: ep_ss_importer
Deposited On: 22 Dec 2008 14:14
Refereed?: No
Published?: Published
Last Modified: 21 Jun 2019 23:42
URI: https://eprints.lancs.ac.uk/id/eprint/20268

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