Finite element analysis to support component level fault modelling for MEMS.

Reichenbach, R. and Rosing, R. and Richardson, Andrew M. D. and Dorey, A. P. (2001) Finite element analysis to support component level fault modelling for MEMS. In: Proceedings of SPIE design, test, integration and packaging of MEMS symposium. UNSPECIFIED, pp. 147-158.

Full text not available from this repository.
Item Type:
Contribution in Book/Report/Proceedings
Uncontrolled Keywords:
/dk/atira/pure/researchoutput/libraryofcongress/ta
Subjects:
ID Code:
20268
Deposited By:
Deposited On:
22 Dec 2008 14:14
Refereed?:
No
Published?:
Published
Last Modified:
21 Nov 2022 13:17