Study on Ultrasound Welding Process of Aluminum/Copper Dissimilar Metals

Tang, Man and Zhang, P. and Yu, Z. and Shi, H. and Li, S. and Wu, D. and Yan, H. and Ye, X. and Wang, F. and Tian, Y. (2020) Study on Ultrasound Welding Process of Aluminum/Copper Dissimilar Metals. Physics of Metals and Metallography, 121 (14). pp. 1400-1410.

[img]
Text (Ultrasound welding of Al-Cu - final)
Ultrasound_welding_of_Al_Cu_final.pdf - Accepted Version
Restricted to Repository staff only until 31 December 2021.
Available under License Creative Commons Attribution-NonCommercial.

Download (1MB)

Abstract

Abstract: Aluminum/copper dissimilar joints are widely used in electronics, the automobile industry, and battery manufacturing. Ultrasonic spot welding (USW), as a quality, efficient, clean, and low-consumption solid phase bonding (SPB) technology, is applicable for the connections of aluminum/copper and other highly conductive and heat-conducting materials. At present, this technique has been applied by automobile producers and lithium battery manufacturers at home and abroad. In this work, the optimal performance of the ultrasonic welding process of aluminum/copper dissimilar joints was studied. Based on a single-factor test on how welding parameters (lap mode, welding pressure, welding amplitude, and welding energy) influence the quality of welding joints, the lap mode of aluminum plates on the top and copper plates on the bottom (Al/Cu) was deemed better than that of copper plates on the top and aluminum plates on the bottom (Cu/Al) under the same optimal parameters (40 psi, 45 μm, and 500 J). With this group of parameters, the Al/Cu joint formed a cladding mechanical occlusion. The element had a diffusion layer of 2 μm and a joint specimen maximum failure load of 605 N. © 2020, Pleiades Publishing, Ltd.

Item Type:
Journal Article
Journal or Publication Title:
Physics of Metals and Metallography
Additional Information:
The final publication is available at Springer via http://dx.doi.org/10.1134/S0031918X20140173
Subjects:
ID Code:
153778
Deposited By:
Deposited On:
13 Apr 2021 10:45
Refereed?:
Yes
Published?:
Published
Last Modified:
07 Dec 2021 13:16