Thermal neutron absorption in printed circuit boards

Platt, Simon and August, Shaun and MacLeod, Michael and Anderson, Mike and Cheneler, David and Monk, Stephen (2021) Thermal neutron absorption in printed circuit boards. IEEE Transactions on Nuclear Science, 68 (4). 463 - 469. ISSN 0018-9499

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Abstract

Measurements and simulations of thermal neutron attenuation by printed circuit boards are compared. Attenuation coefficients in typical epoxy-resin/glass-fibre substrate material can be as high as 2 cm<sup>-1</sup>, corresponding to 27% attenuation by 1.6 mm of substrate. Attenuation is attributed to neutron scattering off hydrogen in the resin acting in synergy with absorption by boron in the glass; this effect is substantially greater than that estimated from absorption by boron alone. Design of thermal neutron detector assemblies should take this attenuation into account and may require board thickness to be minimised or specialised substrate materials to be used.

Item Type:

Journal Article

Journal or Publication Title:

IEEE Transactions on Nuclear Science

Additional Information:

©2021 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.

Uncontrolled Keywords:

/dk/atira/pure/subjectarea/asjc/2100/2104

Subjects:

?? nuclear energy and engineeringelectrical and electronic engineeringnuclear and high energy physics ??

Departments:

Faculty of Science and Technology > Engineering

ID Code:

151876

Deposited By:

ep_importer_pure

Deposited On:

19 Feb 2021 08:42

Refereed?:

Yes

Published?:

Published

Last Modified:

06 Aug 2024 00:13

URI:

https://eprints.lancs.ac.uk/id/eprint/151876