High Performance Printed Electronics on Large Area Flexible Substrates

Soni, Mahesh and Shakthivel, Dhayalan and Christou, Adamos and Zumeit, Ayoub and Yogeswaran, NIvasan and Dahiya, Ravinder (2020) High Performance Printed Electronics on Large Area Flexible Substrates. In: 2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM). IEEE, MYS. ISBN 9781728125404

[img]
Text (215405)
215405.pdf - Accepted Version
Available under License Creative Commons Attribution-NonCommercial.

Download (726kB)

Abstract

Printed electronics has attracted significant interest in recent years due to simple, cost-effective fabrication, reduced e-waste and potential for the development of multifunctional devices over large areas. Over the years, various printing technologies have been developed to pattern flexible surfaces to develop wide range of electronic devices. A large part of the research so far has focussed on organic semiconductors based devices, even if the modest performance they offer is insufficient for several emerging applications (e. g. internet of things (IoTs), smart cities, robotics, etc.) where fast computation and communication are required. The high-performance requirements could be addressed with printed devices from high-mobility materials such as single crystal silicon (Si) and graphene. This paper presents the printing methodologies (i.e. contact and transfer printing) that are being explored for highperformance devices and circuits using nano to macro scale structures such as semiconductor nanowires (NWs), nanoribbon (NR), and ultra-thin chips (UTCs) as well as graphene. Few examples of high-performance devices obtained using contact and transfer printing are also presented.

Item Type:
Contribution in Book/Report/Proceedings
Additional Information:
©2020 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
ID Code:
149762
Deposited By:
Deposited On:
28 May 2021 11:45
Refereed?:
Yes
Published?:
Published
Last Modified:
23 Jun 2021 05:19