Correlation of shear forces and heat conductance in nanoscale junctions

Robinson, Benjamin and Pumarol Crestar, Manuel and Kolosov, Oleg (2019) Correlation of shear forces and heat conductance in nanoscale junctions. Physical Review B: Condensed Matter and Materials Physics, 100 (23). ISSN 2469-9950

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Abstract

Nanoscale solid-solid contacts are key elements which determine the electrical and thermal behavior of modern electronic devices and micro- and nanoelectromechanical systems. Here we show that simultaneous measurements of the shear force and the heat flow in nanoscale junctions reveal a linear correlation between thermal conductance and maximal shear force, confirming the ballistic nature of heat transport in the junction. Furthermore, we find that here the shear strength and thermal conductance in nanoscale contacts for materials where heat transport is phonon dominated can be linked via the fundamental material properties of heat capacity and group velocity of the heat carriers.

Item Type:
Journal Article
Journal or Publication Title:
Physical Review B: Condensed Matter and Materials Physics
Additional Information:
© 2019 American Physical Society
ID Code:
139669
Deposited By:
Deposited On:
17 Dec 2019 16:10
Refereed?:
Yes
Published?:
Published
Last Modified:
18 Sep 2020 05:17