High density indium bumping using electrodeposition enhanced by megasonic agitation

Tian, Yingtao and Liu, Changqing and Hutt, David and Stevens, Bob and Flynn, David and Desmulliez, Marc P. Y. (2009) High density indium bumping using electrodeposition enhanced by megasonic agitation. In: Electronics Packaging Technology Conference, 2009. EPTC '09. 11th. IEEE, pp. 31-35. ISBN 9781424450992

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Abstract

Electrodeposition has been utilized to fulfill the demand of high density indium bumping used in high energy physics applications. Previous studies have shown the capability of electrodeposition to achieve high yield and high density indium bumps. The challenge exists to improve the bump height uniformity and consistency of electroplated indium bumps across the wafer at ultra-fine pitches with the highest yield. This paper reports progress towards the electroplating indium bumping process assisted by megasonic agitation. Electroplating of indium onto non-patterned substrates was initially conducted to investigate the performance of the solution with megasonic agitation. Further trials were carried out on 4 inch silicon dummy wafers to create indium bumps at 50 μm pitch. The results reflect that bubbles created during the plating process with megasonic agitation can affect the quality of the deposit and the yield of indium bumping, under the experimental conditions used in this study.

Item Type:
Contribution in Book/Report/Proceedings
ID Code:
123985
Deposited By:
Deposited On:
12 Mar 2018 09:00
Refereed?:
Yes
Published?:
Published
Last Modified:
01 Jan 2020 10:49