Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation

Tian, Yingtao and Liu, Changqing and Hutt, David and Stevens, Bob and Flynn, David and Desmulliez, Marc P. Y. (2011) Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation. In: Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. IEEE, pp. 739-744. ISBN 9781457717703

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Abstract

Electroplating has been employed to produce metallic micro-bumps to meet the demand of high density flip chip interconnections for high-end electronic devices. Previous studies indicated that megasonic agitation is a promising approach to enable high speed electrodeposition and bumping which therefore can increase the productivity and reduce the cost of the process. This paper takes indium bumping as an example and reports further investigation of the electroplating bumping enhanced by megasonic agitation. Experimental results demonstrate that the bumping process could be accelerated to five times faster than the ordinary DC electroplating situation without any significant effect on the bump height uniformity.

Item Type:
Contribution in Book/Report/Proceedings
ID Code:
123983
Deposited By:
Deposited On:
12 Mar 2018 12:02
Refereed?:
Yes
Published?:
Published
Last Modified:
01 Jan 2020 10:49