Electrodeposition of indium bumps for ultrafine pitch interconnection

Tian, Yingtao and Liu, Changqing and Hutt, David and Stevens, Bob (2014) Electrodeposition of indium bumps for ultrafine pitch interconnection. Journal of Electronic Materials, 43 (2). pp. 594-603. ISSN 0361-5235

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Abstract

Electroplating is a promising method to produce ultrafine pitch indium bumps for assembly of pixel detectors in imaging applications. In this work, the process of indium bumping through electrodeposition was demonstrated and the influences of various current waveforms on the bump morphology, microstructure and height uniformity were investigated. Electron microscopy was used to study the microstructure of electroplated indium bumps and a Zygo white light interferometer was utilised to evaluate the height uniformity. The results indicated that the bump uniformities on wafer, pattern and feature scales were improved by using unipolar pulse and bipolar pulse reverse current waveforms.

Item Type:
Journal Article
Journal or Publication Title:
Journal of Electronic Materials
Uncontrolled Keywords:
/dk/atira/pure/subjectarea/asjc/3100/3104
Subjects:
ID Code:
123977
Deposited By:
Deposited On:
12 Mar 2018 14:18
Refereed?:
Yes
Published?:
Published
Last Modified:
01 Jan 2020 11:13