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Modelling the behaviour of soldier joints for wafer level SIP.

Liu, Hongyuan and Strusevich, N. and Stoyanov, S. and Bailey, C. and Richardson, Andrew M. D. and Dumas, N. and Yannou, J. M. and Georgel, V. (2006) Modelling the behaviour of soldier joints for wafer level SIP. In: Proceedings of the 8th IEEE electronics packaging technology conference. .

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Item Type: Contribution in Book/Report/Proceedings
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Departments: Faculty of Science and Technology > Engineering
ID Code: 8149
Deposited By: Mr Richard Ingham
Deposited On: 11 Apr 2008 13:15
Refereed?: No
Published?: Published
Last Modified: 24 Jan 2014 05:59
Identification Number:
URI: http://eprints.lancs.ac.uk/id/eprint/8149

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