Liu, Hongyuan and Strusevich, N. and Stoyanov, S. and Bailey, C. and Richardson, Andrew M. D. and Dumas, N. and Yannou, J. M. and Georgel, V. (2006) Modelling the behaviour of soldier joints for wafer level SIP. In: Proceedings of the 8th IEEE electronics packaging technology conference. UNSPECIFIED.
Full text not available from this repository.| Item Type: | Contribution in Book/Report/Proceedings |
|---|---|
| Subjects: | T Technology > TA Engineering (General). Civil engineering (General) |
| Departments: | Faculty of Science and Technology > Engineering |
| ID Code: | 8149 |
| Deposited By: | Mr Richard Ingham |
| Deposited On: | 11 Apr 2008 13:15 |
| Refereed?: | No |
| Published?: | Published |
| Last Modified: | 26 Jul 2012 22:10 |
| Identification Number: | |
| URI: | http://eprints.lancs.ac.uk/id/eprint/8149 |
Actions (login required)
| View Item |
