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The Fabrication of MMC Electronic Packages using Thin Shell Electroformed (TSE) EDM Electrodes

Bocking, C. and Jacobson, D.M and Rennie, Allan and Bennett, G. (2001) The Fabrication of MMC Electronic Packages using Thin Shell Electroformed (TSE) EDM Electrodes. In: EAST-Forum 2001: Electrodeposition in Electronics (European Academy of Surface Technology), 2001-10-102001-10-13, Chalkidiki - Ouranoupolis.

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Abstract

Metal matrix Composite (MMC) materials are finding increasing use within the electronics packaging industry due to their excellent CTE, stiffness and thermal management properties. One in particular, a spray formed aluminium/silicon composite, can be compositionally modulated to achieve thermal matching to the electronic materials currently in use. One problem with using these materials lies in their specialised machining requirements - the use of very sharp carbide tools which blunt quickly. An alternative approach has been developed that makes use of thin shell (≤ 1.0 mm) electroforms that can be used as electrical discharge machining electrodes to machine the packages. The technology of TSE is described together with measurements of packages produced by this novel technique.

Item Type: Conference or Workshop Item (Paper)
Journal or Publication Title: EAST-Forum 2001: Electrodeposition in Electronics (European Academy of Surface Technology)
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Departments: Faculty of Science and Technology > Engineering
ID Code: 53008
Deposited By: ep_importer_pure
Deposited On: 15 Mar 2012 13:32
Refereed?: Yes
Published?: Published
Last Modified: 10 Apr 2014 02:51
Identification Number:
URI: http://eprints.lancs.ac.uk/id/eprint/53008

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