Dumas, Norbert and Richardson, Andrew (2006) Towards a health monitor for system in package with MEMS functionality. In: 12th IEEE international mixed signal workshop, 2006-01-212006-01-23.Full text not available from this repository.
This paper introduces a preliminary study about using a health monitor (HM) to contribute towards production and on-line testing of System in Package (SiP) that contain MEMS functions. The HM serves as a central unit for the test of both the structure and critical functions within the SiP. The study includes the review of existing test solution which could be in-tegrated in the HM and some initial ideas to test the MEMS functions as typically, BIST is not normally supported by these devices. A SiP RF transceiver is used as a case study. An evaluation of the feasibility of implementing a HM for testing a MEMS switch is presented. Preliminary simulation results obtained by superimposing a low frequency signal into the bias of the switch are encouraging.
|Item Type:||Conference or Workshop Item (Paper)|
|Journal or Publication Title:||12th IEEE international mixed signal workshop|
|Uncontrolled Keywords:||System in Package ; Test ; Health Monitor ; MEMS testing.|
|Subjects:||T Technology > TK Electrical engineering. Electronics Nuclear engineering|
|Departments:||Faculty of Science and Technology > Engineering|
|Deposited By:||Dr Norbert Dumas|
|Deposited On:||07 May 2007|
|Last Modified:||18 Jun 2016 04:21|
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