Dumas, Norbert and Richardson, Andrew (2006) Towards a health monitor for system in package with MEMS functionality. In: 12th IEEE international mixed signal workshop, 2006-01-212006-01-23, Edinburgh, United Kingdom.
Full text not available from this repository.Abstract
This paper introduces a preliminary study about using a health monitor (HM) to contribute towards production and on-line testing of System in Package (SiP) that contain MEMS functions. The HM serves as a central unit for the test of both the structure and critical functions within the SiP. The study includes the review of existing test solution which could be in-tegrated in the HM and some initial ideas to test the MEMS functions as typically, BIST is not normally supported by these devices. A SiP RF transceiver is used as a case study. An evaluation of the feasibility of implementing a HM for testing a MEMS switch is presented. Preliminary simulation results obtained by superimposing a low frequency signal into the bias of the switch are encouraging.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Journal or Publication Title: | 12th IEEE international mixed signal workshop |
| Uncontrolled Keywords: | System in Package ; Test ; Health Monitor ; MEMS testing. |
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| Departments: | Faculty of Science and Technology > Engineering |
| ID Code: | 499 |
| Deposited By: | Dr Norbert Dumas |
| Deposited On: | 07 May 2007 |
| Refereed?: | Yes |
| Published?: | Published |
| Last Modified: | 27 Jul 2012 02:21 |
| Identification Number: | |
| URI: | http://eprints.lancs.ac.uk/id/eprint/499 |
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