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Extending systems-on-chip to the third dimension : performance, cost and technological tradeoffs.

Weerasekera, Roshan and Zheng, Li-Rong and Pamunuwa, Dinesh B. and Tenhunen, Hannu (2007) Extending systems-on-chip to the third dimension : performance, cost and technological tradeoffs. In: Proc. IEEE/ACM International Conference on Computer-Aided Design (ICCAD). IEEE, San Jose, California, pp. 212-219. ISBN 978-1-4244-1382-9

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    Abstract

    Because of the today's market demand for high-performance, high-density portable hand-held applications, electronic system design technology has shifted the focus from 2-D planar SoC single-chip solutions to different alternative options as tiled silicon and single-level embedded modules as well as 3-D integration. Among the various choices, finding an optimal solution for system implementation dealt usually with cost, performance and other technological trade-off analysis at the system conceptual level. It has been identified that the decisions made within the first 20% of the total design cycle time will ultimately result up to 80% of the final product cost. In this paper, we discuss appropriate and realistic metric for performance and cost trade-off analysis both at system conceptual level (up-front in the design phase) and at implementation phase for verification in the three-dimensional integration. In order to validate the methodology, two ubiquitous electronic systems are analyzed under various implementation schemes and discuss the pros and cons of each of them.

    Item Type: Contribution in Book/Report/Proceedings
    Additional Information: "©2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE." "This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder."
    Subjects: T Technology > TA Engineering (General). Civil engineering (General)
    Departments: Faculty of Science and Technology > Engineering
    ID Code: 31130
    Deposited By: Mr Michael Dunne
    Deposited On: 21 Dec 2009 12:43
    Refereed?: No
    Published?: Published
    Last Modified: 26 Jul 2012 21:42
    Identification Number:
    URI: http://eprints.lancs.ac.uk/id/eprint/31130

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