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Memory technology for extended large-scale integration in future electronics applications.

Pamunuwa, Dinesh B. (2008) Memory technology for extended large-scale integration in future electronics applications. In: Proc. Design, Automation and Test in Europe (DATE) Conference. IEEE, Munich, pp. 1126-1127. ISBN 978-3-9810801-3-1

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    Abstract

    Extending 2-D planar topologies in integrated circuits (ICs) to a 3-D implementation has the obvious benefits of reducing the overall footprint and average interconnection length, with associated improvements in cost, and delay and energy consumption, while also providing an opportunity to integrate disparate technologies. Such advances are very much technology driven, and early research into 3-D integration has now crystallised into commercially viable options that are being pursued by many companies. Being able to position memory in closer proximity to processing elements in a NoC architecture as afforded by a 3-D physical architecture has the potential to improve the memory bandwidth and mitigate the general nature of delay constrained performance in IC design. Understanding the nature of the opportunities and constraints provided in such a 3-D physical architecture is crucial in realising the true benefits of 3-D integration in future applications.

    Item Type: Contribution in Book/Report/Proceedings
    Additional Information: "©2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE." "This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder."
    Subjects: T Technology > TA Engineering (General). Civil engineering (General)
    Departments: Faculty of Science and Technology > Engineering
    ID Code: 31129
    Deposited By: Mr Michael Dunne
    Deposited On: 21 Dec 2009 12:34
    Refereed?: No
    Published?: Published
    Last Modified: 26 Jul 2012 21:42
    Identification Number:
    URI: http://eprints.lancs.ac.uk/id/eprint/31129

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