Weldezion, A. and Weerasekera, Roshan and Pamunuwa, Danesh B. and Zheng, Li-Rong and Tenhunen, Hannu (2009) Bandwidth optimization for through silicon via (TSV) bundles in 3D integrated circuits. In: Workshop Notes, Design, Automation and Test in Europe (DATE). UNSPECIFIED, Nice.
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| PDF (conf9_3DIC_2009.pdf) Download (378Kb) | Preview |
| Item Type: | Contribution in Book/Report/Proceedings |
|---|---|
| Subjects: | T Technology > TA Engineering (General). Civil engineering (General) |
| Departments: | Faculty of Science and Technology > Engineering |
| ID Code: | 31108 |
| Deposited By: | Mr Michael Dunne |
| Deposited On: | 18 Dec 2009 16:15 |
| Refereed?: | No |
| Published?: | Published |
| Last Modified: | 26 Jul 2012 21:42 |
| Identification Number: | |
| URI: | http://eprints.lancs.ac.uk/id/eprint/31108 |
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