Weerasekera, Roshan and Pamunuwa, Dinesh B. and Grange, M. and Tenhunen, Hannu and Zheng, Li-Rong (2009) Closed-form equations for through-silicon via (TSV) parasitics in 3-D integrated circuits (ICs). In: Workshop Notes, Design, Automation and Test in Europe (DATE). UNSPECIFIED, Nice.
![[img]](http://eprints.lancs.ac.uk/style/images/fileicons/application_pdf.png)
| PDF (conf7_DATEWS_2009.pdf) Download (107Kb) | Preview |
| Item Type: | Contribution in Book/Report/Proceedings |
|---|---|
| Subjects: | T Technology > TA Engineering (General). Civil engineering (General) |
| Departments: | Faculty of Science and Technology > Engineering |
| ID Code: | 31106 |
| Deposited By: | Mr Michael Dunne |
| Deposited On: | 18 Dec 2009 15:39 |
| Refereed?: | No |
| Published?: | Published |
| Last Modified: | 26 Jul 2012 21:42 |
| Identification Number: | |
| URI: | http://eprints.lancs.ac.uk/id/eprint/31106 |
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