Closed-form equations for through-silicon via (TSV) parasitics in 3-D integrated circuits (ICs).

Weerasekera, Roshan and Pamunuwa, Dinesh B. and Grange, M. and Tenhunen, Hannu and Zheng, Li-Rong (2009) Closed-form equations for through-silicon via (TSV) parasitics in 3-D integrated circuits (ICs). In: Workshop Notes, Design, Automation and Test in Europe (DATE) :. UNSPECIFIED, Nice.

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Item Type:
Contribution in Book/Report/Proceedings
Uncontrolled Keywords:
/dk/atira/pure/researchoutput/libraryofcongress/ta
Subjects:
?? ta engineering (general). civil engineering (general) ??
ID Code:
31106
Deposited By:
Users 49 not found.
Deposited On:
18 Dec 2009 15:39
Refereed?:
No
Published?:
Published
Last Modified:
05 Mar 2024 01:57