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Scalability of Network-on-Chip communication architecture for 3-D meshes.

Weldezion, A. Y. and Grange, M. and Pamunuwa, Dinesh Bandara and Lu, Zhonghai and Jantsch, A. and Weerasekera, Roshan and Tenhunen, Hannu (2009) Scalability of Network-on-Chip communication architecture for 3-D meshes. In: Proc. ACM/IEEE International Symposium on Networks on Chip (NOCS). IEEE, San Diego, pp. 114-123. ISBN 978-1-4244-4142-6

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    Abstract

    Design constraints imposed by global interconnect delays as well as limitations in integration of disparate technologies make 3D chip stacks an enticing technology solution for massively integrated electronic systems. The scarcity of vertical interconnects however imposes special constraints on the design of the communication architecture. This article examines the performance and scalability of different communication topologies for 3D network-on-chips (NoC) using through-silicon-vias (TSV) for inter-die connectivity. Cycle accurate RTL-level simulations are conducted for two communication schemes based on a 7-port switch and a centrally arbitrated vertical bus using different traffic patterns. The scalability of the 3D NoC is examined under both communication architectures and compared to 2D NoC structures in terms of throughput and latency in order to quantify the variation of network performance with the number of nodes and derive key design guidelines.

    Item Type: Contribution in Book/Report/Proceedings
    Additional Information: "©2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE." "This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder."
    Subjects: T Technology > TA Engineering (General). Civil engineering (General)
    Departments: Faculty of Science and Technology > Engineering
    ID Code: 31105
    Deposited By: Mr Michael Dunne
    Deposited On: 18 Dec 2009 15:29
    Refereed?: No
    Published?: Published
    Last Modified: 26 Jul 2012 21:42
    Identification Number:
    URI: http://eprints.lancs.ac.uk/id/eprint/31105

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