Reichenbach, R. and Rosing, R. and Richardson, Andrew M. D. and Dorey, A. P. (2001) Finite element analysis to support component level fault modelling for MEMS. In: Proceedings of SPIE design, test, integration and packaging of MEMS symposium. UNSPECIFIED, pp. 147-158.
Full text not available from this repository.| Item Type: | Contribution in Book/Report/Proceedings |
|---|---|
| Subjects: | T Technology > TA Engineering (General). Civil engineering (General) |
| Departments: | Faculty of Science and Technology > Engineering |
| ID Code: | 20268 |
| Deposited By: | ep_ss_importer |
| Deposited On: | 22 Dec 2008 14:14 |
| Refereed?: | No |
| Published?: | Published |
| Last Modified: | 26 Jul 2012 21:15 |
| Identification Number: | |
| URI: | http://eprints.lancs.ac.uk/id/eprint/20268 |
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